Aluminum Nitride Ball
Aluminum Nitride Ball
Purity: 95%-99%
- Custom sizes and standard sizes in stock
- Quick Lead Time
- Competitive Price
Aluminum Nitride Ball is a high-performance ceramic material with exceptional thermal conductivity, electrical insulation, and high-temperature resistance. It is widely used for electronic heat dissipation, mechanical bearing, semiconductor equipment, and aerospace. As a leading supplier and manufacturer of premium alumina products, Shanghai Yuepeng can supply high-quality aluminum nitride balls with various specifications and competitive prices, offering customized solutions to meet specific requirements
Aluminum Nitride Ball Data Sheet
| Reference Code: | HM1924 |
| Purity: | 95%-99% |
| Density: | 3.32 g/cm3 |
| Appearance: | Dark Gray / Light Gray / Beige |
Aluminum Nitride Ball Description
Aluminum Nitride Ball is made from high-purity aluminum nitride ceramic, possessing exceptional thermal conductivity (170-230 W/m·K), excellent electrical insulation, and high-temperature resistance (up to over 1000℃). It is manufactured using advanced processes, offering high hardness, a low thermal expansion coefficient, and excellent corrosion resistance. Shanghai Yuepeng can supply customized solutions for various specifications to meet diverse industrial and research requirements.
Aluminum Nitride Ball Advantages
- High thermal conductivity (170-230 W/mK), up to 9.5 times that of alumina.
- A thermal expansion coefficient similar to that of silicon (Si).
- Superior electrical insulation and lower dielectric constant.
- Higher mechanical strength (450 MPa).
- Excellent resistance to molten metal corrosion.
- High purity and non-toxic.
Aluminum Nitride Ball Applications
- Grinding Media: Used as high-performance grinding balls for processing advanced ceramics, metals, and semiconductor materials due to their high hardness and thermal conductivity.
- Thermal Management Systems: Applied as filler balls in heat-dissipation structures for electronics, LEDs, and power devices to improve thermal conductivity.
- Semiconductor Industry: Utilized in wafer handling and processing equipment, offering chemical resistance and low contamination.
- High-Temperature Bearings: Serve as bearing balls in extreme environments, maintaining stability under high heat and corrosive conditions.
- Research and Development: Employed in laboratory and material science applications requiring chemically inert and thermally stable spherical materials.
Grinding Media
Thermal Management Materials
Semiconductor Industry
Material research
Aluminum Nitride Material Properties
Aluminum Nitride Material Grades
HMAN1000 is our standard high purity aluminium nitride with a thermal conductivity of 170 W/mK. This is the same thermal performance as our substrate material but offers the possibility of larger pieces in length/width and in thicknesses up to 30mm.
HMAN1000 has good coefficient of thermal expansion – matched to silicon and gallium nitride over wide temperature ranges.
HMAN100 Applications:
- High power insulators
- Laser components
- Water cooled heatsinks
- Power electronics
- Aerospace, medical and semiconductor components
HMAN1000S 170 W/mK is our standard high thermal conductivity substrate material, However, other high-performance grades are also available.
HMAN1000S Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN2000 is one of our enhanced grades of aluminium nitride, offering all the mechanical performance of HMAN1000 with the enhanced benefits of 200 W/mK thermal conductance.
HMAN2000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN3000 is one of our enhanced grades of aluminium nitride offering, all the mechanical performance of HMAN1000 with the enhanced benefits of 230 W/mK thermal conductance.
HMAN3000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN4000 is one of our enhanced grades of aluminium nitride offering, all the mechanical performance of HMAN1000 with the enhanced benefits of 200 W/mK thermal conductance.
HMAN4000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
Aluminum Nitride Ceramic Machining
Aluminum Nitride (AlN) ceramic machining is a precise process used to fabricate high-performance components from aluminum nitride materials. Machining aluminum nitride ceramics requires specialized equipment and techniques to handle their brittleness and hardness. Proper tooling and controlled environments are essential to avoid material damage and achieve the desired surface finish and dimensional accuracy. The common machining methods are as follows:
- Diamond Cutting: Diamond tools are used to achieve fine precision and smooth surface finishes, ideal for complex shapes.
- Laser Cutting: A non-contact method used for intricate shapes, with high precision and minimal thermal impact.
- Precision Grinding: Utilized to achieve fine tolerances and surface finishes. Requires special care to prevent cracking or chipping due to the ceramic’s brittleness.
- Wire EDM (Electrical Discharge Machining): A method often used for intricate cutting, especially for thin and complex geometries.
Aluminum Nitride Ceramic Packaging
Aluminum Nitride Ceramic products are typically packaged in vacuum-sealed bags to prevent moisture or contamination and wrapped with foam to cushion vibrations and impacts during transport, ensuring the quality of products in their original condition.
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