Aluminum Nitride Sputtering Target
Aluminum Nitride Sputtering Target
- Purity: 99.5%-99.9%
- Custom sizes and standard sizes in stock
- Quick Lead Time
- Competitive Price
Aluminum Nitride Sputtering Target is made from high-purity aluminum oxide with uniform composition and dense structure, widely used in thin film deposition and the semiconductor industry. As a leading supplier and manufacturer of premium alumina products, Shanghai Yuepeng can supply high-quality aluminum nitride sputtering targets with various specifications and competitive prices, offering customized solutions to meet specific requirements.
Aluminum Nitride Sputtering Target Data Sheet
| Reference Code: | HMST457 |
| Purity: | 99.5%-99.9% |
| Density: | 3.26 g/cm3 |
| Appearance: | Bluish White, Crystalline Solid |
| Shape: | Rectangular, Disc, or Tube |
| Bonding Service: | Unbonding, or Bonding |
| Melting Point: | >2200℃ |
| Z Ratio: | 1.00 |
| Sputter: | RF-R |
Aluminum Nitride Sputtering Target Description
Aluminum Nitride (AlN) Sputtering Target is a high-performance ceramic sputtering target material, featuring exceptional thermal conductivity, electrical resistivity, and hardness. Its uniform composition and dense structure make it ideal for producing smooth, defect-free films through magnetron sputtering or ion beam deposition. They are widely used in microelectronics, optoelectronics, and photovoltaics. Shanghai Yuepeng can provide customized solutions in terms of purity, size, density, and other parameters to meet diverse industrial and research applications.
Aluminum Nitride Sputtering Target Specifications
| Circular Sputtering Targets | Diameter | 1.0″ 2.0″ 3.0″ 4.0″ 5.0″ 6.0″ up to 21″ |
| Rectangular Sputtering Targets | Width x Length | 5” x 12″ 5” x 15″ 5” x 20″ 5” x 22″ 6” x 20″ |
| Thickness | 0.125″, 0.25″ | |
Aluminum Nitride Sputtering Target Advantages
- High purity and density
- Low particle
- Uniform film thickness distribution
- High efficiency in the use
Aluminum Nitride Sputtering Target Applications
- Semiconductor Thin Films: Used to deposit insulating and thermally conductive layers in integrated circuits and microelectronic devices.
- Optoelectronic Devices: Applied in the fabrication of LEDs, laser diodes, and photodetectors to improve efficiency and durability.
- Protective Coatings: Provides hard, wear-resistant, and oxidation-resistant coatings for tools, optics, and electronic components.
- Display Technology: Utilized in thin-film deposition for flat panel displays, enhancing the performance and reliability of TFT and OLED systems.
- Surface Engineering: Enables the creation of customized thin films with high thermal conductivity and electrical insulation for advanced industrial and aerospace applications.
Display Technology
Optoelectronic Devices
Protective Coatings
Semiconductor Thin Films
Surface Engineering
Aluminum Nitride Material Properties
Aluminum Nitride Material Grades
HMAN1000 is our standard high purity aluminium nitride with a thermal conductivity of 170 W/mK. This is the same thermal performance as our substrate material but offers the possibility of larger pieces in length/width and in thicknesses up to 30mm.
HMAN1000 has good coefficient of thermal expansion – matched to silicon and gallium nitride over wide temperature ranges.
HMAN100 Applications:
- High power insulators
- Laser components
- Water cooled heatsinks
- Power electronics
- Aerospace, medical and semiconductor components
HMAN1000S 170 W/mK is our standard high thermal conductivity substrate material, However, other high-performance grades are also available.
HMAN1000S Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN2000 is one of our enhanced grades of aluminium nitride, offering all the mechanical performance of HMAN1000 with the enhanced benefits of 200 W/mK thermal conductance.
HMAN2000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN3000 is one of our enhanced grades of aluminium nitride offering, all the mechanical performance of HMAN1000 with the enhanced benefits of 230 W/mK thermal conductance.
HMAN3000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN4000 is one of our enhanced grades of aluminium nitride offering, all the mechanical performance of HMAN1000 with the enhanced benefits of 200 W/mK thermal conductance.
HMAN4000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
Aluminum Nitride Ceramic Machining
Aluminum Nitride (AlN) ceramic machining is a precise process used to fabricate high-performance components from aluminum nitride materials. Machining aluminum nitride ceramics requires specialized equipment and techniques to handle their brittleness and hardness. Proper tooling and controlled environments are essential to avoid material damage and achieve the desired surface finish and dimensional accuracy. The common machining methods are as follows:
- Diamond Cutting: Diamond tools are used to achieve fine precision and smooth surface finishes, ideal for complex shapes.
- Laser Cutting: A non-contact method used for intricate shapes, with high precision and minimal thermal impact.
- Precision Grinding: Utilized to achieve fine tolerances and surface finishes. Requires special care to prevent cracking or chipping due to the ceramic’s brittleness.
- Wire EDM (Electrical Discharge Machining): A method often used for intricate cutting, especially for thin and complex geometries.
Aluminum Nitride Ceramic Packaging
Aluminum Nitride Ceramic products are typically packaged in vacuum-sealed bags to prevent moisture or contamination and wrapped with foam to cushion vibrations and impacts during transport, ensuring the quality of products in their original condition.
Download
Get A Quote
We will check and get back to you in 24 hours.
