Aluminum Nitride Surface Modification Powder

Aluminum Nitride Surface Modification Powder Data Sheet

Reference Code:	HM1911
Purity:	99%-99.9%
Particle Size:	30-120 μm or customized
CAS:	24304-00-5
Melting Point:	2200℃
Boiling Point:	2249℃

Aluminum Nitride Surface Modification Powder Description

Aluminum Nitride Powder has poor stability and can be hydrolyzed in water at ambient temperature, resulting in a decrease in the thermal conductivity of the powder. We offer a range of modified aluminum nitride powders tailored to various applications. Choose the right modification based on your needs: silane modification for better resin compatibility or hydrolysis-resistant treatment for improved moisture resistance.

Aluminum Nitride Surface Modification Powder Specifications

Item		HM-F1T08	HM-F120T01
D50 (μm)		1.41	121.6
Specific area (m2/g)		1.28	0.01
Impurity Content	O (%)	0.93	1.41
	Ca (ppm)	<300	<300
	Fe (ppm)	<25	<50
	Si (ppm)	<20	<30
Apparent density (g/cm3)		1.05	1.81
Tap density (g/cm3)		1.64	2.04
Moisture (%)		0.02	0.02

Aluminum Nitride Surface Modification Powder Morphology

Aluminum Nitride Surface Modification Powder Particle Size Distribution

Aluminum Nitride Surface Modification Powder Features

• High thermal conductivity
• Strong hydrolysis resistance
• Excellent hydrophobicity
• Narrow particle size distribution

Aluminum Nitride Powder Surface Modification Solutions

Tailor your aluminum nitride powder with specialized surface treatments to achieve optimal performance:

• Silane Coupling Agent Modification: Improves dispersion and bonding in polymer matrices (e.g., epoxy, silicone) for superior composite performance.
• Inorganic Hydrolysis Resistant Treatment: Provides long-term stability in humid or aqueous environments by preventing moisture degradation.
• Dual Modification (Silane + Hydrolysis Resistance): Combines enhanced resin compatibility with environmental protection for demanding applications.

Aluminum Nitride Surface Modification Powder Hydrolysis Testing

The unmodified AIN undergoes almost complete hydrolysis after 2 hours at 70°C, resulting in a strong, irritating ammonia odor and significant clumping at the bottom of the cup. In contrast, our modified product shows no ammonia odor and no clumping even after 72 hours of hydrolysis, with almost no signs of hydrolysis.

• Experimental Conditions: 30g of Aluminum Nitride, 300g of pure water, water temperature at 70°C.
• Experimental Method: The degree of hydrolysis is determined by observing the experimental phenomena and measuring the pH value of the solution.

Time (h)	0	1.0	2.0	5.0	10.0	24.0	48.0	72.0
AlN Modified Powder (pH)	5.6	5.7	5.7	5.8	5.9	6.1	6.15	6.15
AlN Unmodified Powder (pH)	7.6	9.4	10.2	10.2	10.1	9.8	9.6	9.6

AlN Powder with Inorganic Hydrolysis-Resistant Modification

AlN is widely used in electronics for its high thermal conductivity (320 W/(m·K)), but it reacts with water after moisture absorption, reducing its thermal performance. Surface treatment with coupling agents can lower its hydrolysis, but limits further treatment. Shanghai Yuepeng’s inorganic coating method overcomes this, allowing further organic coatings and providing better stability for high-reliability applications. 

Product Name	Aluminum Nitride Filler Powder WR Type
Equipment and Materials	Thermostatic water bath, beaker, pure water, wide-range pH test paper
Test Procedure	1. Set the water bath to 80°C. 2. Weigh 10g of sample into a 250ml beaker, add pure water to the 100ml mark. 3. Place the beaker in a water bath, monitor pH changes (add pure water as needed).
Test Results (L/LG Grade)	7 days	14 days	30 days
	pH = 7	pH ≤ 7.5	pH ≤ 8.5
Test Results (G Grade)	7 days	14 days	30 days
	pH = 7	pH ≤ 7	pH ≤ 7.5
Remarks	Ordinary AlN powder: pH >10 in 15 mins, ammonia odor, clumping. WR-coated powder: pH < 8.5 after 30 days, no ammonia odor, no clumping.

Aluminum Nitride Powder Solutions

Aluminum Nitride Surface Modification Powder Applications

• Polymer Modification: Improves the thermal conductivity and mechanical strength of polymer composites while maintaining electrical insulation.
• Metal Surface Treatment: Enhances wear resistance, oxidation resistance, and thermal stability of metal parts in demanding environments.
• Ceramic Reinforcement: Strengthens ceramic matrices by improving toughness, thermal conductivity, and resistance to thermal shock.
• Electronic Packaging: Applied to semiconductor and microelectronic devices to improve heat dissipation and reliability.
• Coating Additives: Used in coatings to increase thermal management, corrosion resistance, and durability for aerospace, automotive, and industrial applications.

Aluminum Nitride Surface Modification Powder Packaging

The Aluminum Nitride Surface Modification Powder is carefully placed in wooden cases or cartons with additional support from soft materials to prevent any shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.