Aluminum Silicon Carbide Heat Sink

Aluminum Silicon Carbide Heat Sink Data Sheet

Chemical Formula:	Al-SiC
Shape:	Customized
Dimension:	Standard or customized

Aluminum Silicon Carbide Heat Sink Description

Aluminum Silicon Carbide Heat Sink is a high-performance thermal management material characterized by low thermal expansion, high thermal conductivity, lightweight properties, and high stiffness, making it ideal for both military and civilian microelectronics. Its coefficient of thermal expansion matches dielectric substrates, ceramic BGAs, LTCC, and PCBs, ensuring excellent thermal and mechanical reliability, while high thermal conductivity enables efficient heat dissipation, and high strength protects integrated circuits during assembly. Typical applications include flip-chip lids, heat sinks for ASICs and power modules, and CPU or server processor heat spreaders, making Al-SiC a preferred choice for demanding electronic devices.

Aluminum Silicon Carbide Material Chemical Composition

Technology	Material Reference Code	Volume Fraction		Performance Advantages	Application Directions
		SiC (%)	Al (%)
RSPM + HIP (Rapid Solidification + HIP)	HMA15	15	85	☑High specific strength & stiffness ☑Low density ☑Excellent wear resistance ☑Good heat resistance	☑Lightweight and wear-resistant components ☑Alternative to aluminum alloys, cast steel, cast iron, and titanium alloys ☑Brake components, pistons, connecting rods, fighter belly fins, helicopter rotor forgings
	HMA30	30	70
	HMA40	40	60	☑High specific strength & stiffness ☑High micro-yield strength ☑Low thermal expansion ☑High thermal conductivity	☑Aerospace and defense applications ☑Optical mirrors, inertial navigation system components ☑Alternative to beryllium, glass-ceramics, quartz glass
	HMA50	50	50
Pressure Infiltration (PI)	HMA55	55	45	☑High specific modulus ☑Low density ☑Low thermal expansion ☑High thermal conductivity	☑Thermal management materials for military and civilian use ☑Military IGBT substrates, PCB substrates, heat dissipation baseplates ☑Electronic component bases and housings, power amplifier module housings and bases ☑Alternative to W/Cu, Mo/Cu, Kovar alloys
	HMA65	65	35
	HMA70	70	30

Aluminum Silicon Carbide Heat Sink Features

• Advanced Composite Composition: Made of silicon carbide particles reinforced within an aluminum matrix, combining the high hardness of ceramics with the toughness of metal.
• Dual-Network Structure: Produced by infiltrating molten aluminum into a 3D foam SiC framework, resulting in a strong interpenetrating network of SiC and Al.
• High Thermal Conductivity: Offers excellent heat transfer performance in the range of 180–220 W/m·K, ensuring rapid heat dissipation.
• Low Thermal Expansion: CTE closely matches semiconductor materials like Si and GaAs, minimizing thermal stress and preventing fatigue damage.
• Lightweight & Durable: Features low density, high hardness, strong flexural strength, and exceptional corrosion resistance for stable performance in demanding environments.

Aluminum Silicon Carbide Heat Sink Applications

• Power Electronics Cooling: Used in IGBT modules, MOSFETs, and high-power converters to efficiently dissipate heat and ensure stable operation.
• Automotive Electronics: Applied in electric vehicle inverters, onboard chargers, and battery management systems, enhancing thermal management and extending component lifespan.
• Renewable Energy Systems: Integrated into wind turbines and solar inverters to handle high thermal loads in continuous power generation.
• Aerospace and Defense: Serves as a lightweight, high-strength heat sink for radar, avionics, and military power modules requiring reliable cooling under extreme environments.
• High-Performance Computing: Supports CPUs, GPUs, and data center servers with efficient thermal management for stable and long-term operation.