Aluminum Silicon Carbide IGBT Base Plate

Aluminum Silicon Carbide IGBT Base Plate Data Sheet

Chemical Formula:	Al-SiC
Shape:	Plate
Dimension:	Standard or customized

Aluminum Silicon Carbide IGBT Base Plate Description

Aluminum Silicon Carbide IGBT Base Plate is designed to meet the rigorous thermal and mechanical requirements of modern power electronics. This composite material merges the superior thermal conductivity of aluminum with the exceptional hardness and low thermal expansion of silicon carbide, ensuring efficient heat dissipation and minimizing thermal stress in IGBT modules. Its stable structure enhances resistance to deformation and cracking during rapid temperature changes, improving the reliability and lifespan of power devices.

Aluminum Silicon Carbide Material Chemical Composition

Technology	Material Reference Code	Volume Fraction		Performance Advantages	Application Directions
		SiC (%)	Al (%)
RSPM + HIP (Rapid Solidification + HIP)	HMA15	15	85	☑High specific strength & stiffness ☑Low density ☑Excellent wear resistance ☑Good heat resistance	☑Lightweight and wear-resistant components ☑Alternative to aluminum alloys, cast steel, cast iron, and titanium alloys ☑Brake components, pistons, connecting rods, fighter belly fins, helicopter rotor forgings
	HMA30	30	70
	HMA40	40	60	☑High specific strength & stiffness ☑High micro-yield strength ☑Low thermal expansion ☑High thermal conductivity	☑Aerospace and defense applications ☑Optical mirrors, inertial navigation system components ☑Alternative to beryllium, glass-ceramics, quartz glass
	HMA50	50	50
Pressure Infiltration (PI)	HMA55	55	45	☑High specific modulus ☑Low density ☑Low thermal expansion ☑High thermal conductivity	☑Thermal management materials for military and civilian use ☑Military IGBT substrates, PCB substrates, heat dissipation baseplates ☑Electronic component bases and housings, power amplifier module housings and bases ☑Alternative to W/Cu, Mo/Cu, Kovar alloys
	HMA65	65	35
	HMA70	70	30

Aluminum Silicon Carbide IGBT Base Plate Features

• Superior Thermal Conductivity: Ensures efficient heat dissipation to maintain optimal operating temperatures in IGBT modules.
• Low Coefficient of Thermal Expansion: Reduces thermal stress and prevents warping during temperature fluctuations.
• High Mechanical Strength: Provides excellent resistance to cracking and deformation under thermal cycling.
• Lightweight Design: Combines aluminum’s lightness with silicon carbide’s strength for easy integration and handling.
• Customizable Sizes: Available in various dimensions to fit specific power electronics applications.

Aluminum Silicon Carbide IGBT Base Plate Applications

• Power Electronics: Used as base plates in IGBT modules to provide high thermal conductivity and mechanical strength, ensuring stable operation in power conversion systems.
• Automotive Industry: Applied in electric vehicle inverters and hybrid systems, enhancing heat dissipation and extending the lifespan of power modules.
• Renewable Energy Systems: Integrated into wind power converters and solar inverters, where reliable thermal management and structural stability are required.
• Industrial Equipment: Used in high-power drives, motor control systems, and automation equipment to improve performance and reduce thermal stress.
• Aerospace and Defense: Supports advanced electronic power modules in aircraft and military systems, offering lightweight design and superior reliability under harsh environments.