Beryllium Oxide Heat Sinks
Beryllium Oxide Heat Sinks
- Custom sizes and standard sizes in stock
- Quick Lead Time
- Competitive Price
Beryllium Oxide Heat Sinks provide superior thermal conductivity combined with excellent electrical insulation, making them ideal for managing heat in high-power electronic devices such as RF amplifiers, laser diodes, and power transistors. Their strong resistance to thermal shock and chemical corrosion ensures durability and reliable performance in demanding environments like aerospace, telecommunications, and industrial electronics. Precisely machined, these heat sinks help maintain device efficiency and extend operational life. As a leading supplier and manufacturer of premium beryllium oxide products, Shanghai Yuepeng can supply high-quality Beryllium Oxide Heat Sinks with various specifications and competitive prices, offering customized solutions to meet specific requirements.
Beryllium Oxide Heat Sinks Data Sheet
| Color: | White |
| Chemical Formula: | BeO |
| Dimension: | customized |
| Machining Accuracy: | 0.01 mm |
| Surface Roughness: | 0.1 μm |
Beryllium Oxide Heat Sinks Description
Beryllium Oxide Heat Sinks combine outstanding thermal conductivity with electrical insulation, making them an ideal solution for managing heat in compact, high-performance electronic systems. With a thermal conductivity of up to 285 W/m·K, they outperform many traditional ceramics, such as alumina or aluminum nitride. These heat sinks are widely used in power electronics, RF/microwave devices, and laser systems, where efficient heat dissipation is critical to prevent device failure and ensure long-term stability. Their low dielectric constant and high mechanical strength also support miniaturization and reliability in demanding environments.
Beryllium Oxide Heat Sinks Chemical Compositions
| Element | Content (ppm) |
|---|---|
| Boron (B) | 2 |
| Aluminum (Al) | 46 |
| Chromium (Cr) | 8 |
| Iron (Fe) | 32 |
| Magnesium (Mg) | 1000 |
| Manganese (Mn) | 2 |
| Nickel (Ni) | 9 |
| Titanium (Ti) | 5 |
| Sodium (Na) | 173 |
| Calcium (Ca) | 31 |
| Silicon (Si) | 2100 |
Beryllium Oxide Heat Sinks Features
- Exceptional Thermal Conductivity: Offers up to 285 W/m·K, enabling efficient heat dissipation in compact systems.
- Electrical Insulation: Combines thermal management with dielectric strength, ideal for electronic isolation.
- High Mechanical Strength: Maintains structural integrity under thermal and mechanical stress.
- Low Dielectric Constant: Suitable for high-frequency applications like RF and microwave systems.
- Chemical Stability: Resistant to oxidation and corrosion, ensuring durability in harsh environments.
Beryllium Oxide Heat Sinks Applications
- High-Power Electronics Cooling: BeO heat sinks are used to dissipate heat from transistors, power amplifiers, and high-frequency devices, preventing overheating and ensuring stable performance.
- LED and Optoelectronic Devices: They serve as thermal management solutions for LEDs, laser diodes, and photonic devices, maintaining consistent light output and device longevity.
- Semiconductor Packaging: BeO heat sinks are applied in chip packaging and module assemblies, providing efficient thermal conduction while maintaining electrical isolation.
- Aerospace and Defense Electronics: They are used in avionics, radar, and defense systems where lightweight, high thermal conductivity, and electrical insulation are critical under extreme conditions.
- Medical and Analytical Equipment: BeO heat sinks manage heat in imaging devices, laser systems, and diagnostic instruments, ensuring precise operation and extended equipment life.
Defense and Aerospace
Medical Devices
Optical and electronic industries
Semiconductor Packaging
LED and Optoelectronics
Beryllium Oxide Ceramic Properties
Beryllium Oxide Ceramic Material Machining
Beryllium Oxide (BeO) Ceramic is valued for its exceptional thermal conductivity, electrical insulation, and high melting point. These qualities make it widely used in electronics and high-temperature applications, but its hardness and brittleness require special machining approaches. Key machining considerations include:
- Cutting: Precision diamond-coated tools or laser cutting are essential to avoid microcracks and maintain clean edges, as BeO’s brittleness can lead to chipping during conventional cutting.
- Grinding: Fine diamond grinding wheels enable accurate shaping and surface finishing while minimizing the risk of fractures, especially important for small or complex parts.
- Drilling: Ultrasonic machining or abrasive waterjet methods are preferred to produce precise holes without causing thermal damage or cracks.
- Surface Finishing: Polishing techniques enhance surface smoothness and electrical insulation properties, crucial for applications demanding high dielectric performance and reliability.
Beryllium Oxide Ceramic Packaging
Beryllium Oxide Ceramic products are typically packaged in vacuum-sealed bags to prevent moisture or contamination and wrapped with foam to cushion vibrations and impacts during transport, ensuring the quality of the products in their original condition.
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