Boron Nitride Spherical Powder

Boron Nitride Spherical Powder Data Sheet

Reference:	HM1972
CAS:	10043-11-5
Purity:	99% or 99.5%
Particle Size:	0.5 μm, 1-2 μm, 3-5 μm, 5-10 μm, 10-15 μm, 15-20 μm, 20-30 μm, or customized according to specific requirements.
Color:	White
Melting Point:	2937 ℃
Density:	1.9-2.2 g/cm3
Dielectric Constant:	4.3
Dielectric Strength:	80 kV/mm
Thermal Conductivity:	300 W/mK

Boron Nitride Spherical Powder Description

Boron Nitride Spherical Powder is an advanced material with high thermal conductivity, electrical insulation, high-temperature resistance, and exceptional chemical stability. Its polycrystalline sphere structure provides superior flowability and dispersion, improving the filler content of boron nitride in the system. This enables efficient packing of boron nitride particles, resulting in multidirectional and continuous heat conduction. As a result, it reduces the thermal interface resistance between the substrate and filler, leading to a significant thermal efficiency. Shanghai Yuepeng can also supply boron nitride products with high purity and different additives based on specific requirements.

Boron Nitride Spherical Powder SEM

Boron Nitride Spherical Powder Specifications

Product	Particle Size (D50)	Specific Surface Area	Tap Density	pH Value	Moisture	Purity
	μm	m2/g	g/cm3	—	%	%
HMGBN-60	60-75	≤3	≤0.5	≤10.0	≤0.15	≥99.3
HMGBN-100	95-115	≤3	≤0.5	≤10.0	≤0.15	≥99.3
HMGBNL-120	125-135	≤3	≤0.5	≤10.0	≤0.10	≥99.3
HMGBN-160	170-200	≤3	0.47-0.53	≤10.0	≤0.10	≥99.3
HMGBN-200	190-215	≤3.5	0.35-0.40	≤10.0	≤0.10	≥99.3

Boron Nitride Powder Fine Particle Solutions

Boron Nitride Spherical Powder Advantages

• Uniform particle size and narrow distribution
• High filling
• Good flowability
• High thermal conductivity
• Low dielectric

Boron Nitride Spherical Powder Applications

• Thermal management materials: Boron Nitride Spherical Powder can improve thermal efficiency in thermal interface materials, heat sinks, LEDs, power semiconductors, and other electronic devices.
• Electronic packaging materials: Boron nitride spherical powder can be used as a thermal conductive material in electronic packaging to enhance heat dissipation and improve the performance of electronic components.
• Reinforcing materials for plastics and rubbers: Boron nitride spherical powder can enhance the thermal stability, mechanical strength, and wear resistance of plastics and rubbers.
• Protective coatings: Boron nitride spherical powder can be used as coatings to improve resistance to corrosion and high temperatures.

Boron Nitride Spherical Powder Packaging

The Boron Nitride Spherical Powder is carefully placed in wooden cases or cartons with additional support from soft materials to prevent any shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.