Tungsten Sputtering Target

Tungsten Sputtering Target Data Sheet

Reference:	HMST24
Material:	Tungsten
Purity:	99%, 99.9%, 99.95%, 99.99%, 99.999%
Shape:	Disc, Rectangular, Rotary, or Customized
Bonding:	Unbonding, or Bonding

Tungsten Sputtering Target

Tungsten Sputtering Target is a high-performance deposition material, widely used in semiconductors, chemical vapor deposition (CVD), physical vapor deposition (PVD), and optical applications. Shanghai Yuepeng can offer customized solutions and bonding services to meet specific requirements.

Tungsten Sputtering Target Material Chemical Composition

W (>%)	Chemical Content (<%)
99.999 W1	Fe	Ca	Be	Sn	Al	Ni	Zn	Sb	Pt	K	Ta	Na
	0.0001	0.00005	0.000005	0.000005	0.00005	0.00001	0.00005	0.00005	0.00003	0.000005	0.0001	0.00005
	Cr	Pb	As	Mg	Ti	Bi	Mo	Cd	Cu	Ba	Co	Mn
	0.000005	0.00001	0.00005	0.00005	0.000005	0.00001	0.00001	0.000005	0.000007	0.00001	0.000005	0.000005
99.99 W2	Fe	Ca	Be	Sn	Al	Ni	Zn	Sb	Pt	K	O	Na
	0.0001	0.00045	0.0001	0.0001	0.0001	0.0001	0.0001	0.0001	0.0001	0.0005	0.0040	0.0009
	Cr	Pb	As	Mg	Ti	Bi	Mo	Cd	Cu	Ba	Co	Mn
	0.0001	0.0001	0.0001	0.0001	0.0001	0.0001	0.0002	0.0001	0.0001	0.0001	0.0001	0.0001
99.95 W3	Fe	Ca	P	Sn	Al	Ni	N	Sb	Si	O	Pb	As
	0.005	0.003	0.001	0.0001	0.002	0.003	0.003	0.001	0.003	0.003	0.0001	0.002
	Mg	C	Bi	Mo
	0.002	0.005	0.0001	0.001

Tungsten Sputtering Target Specifications

Material Type	Tungsten	Coefficient of Thermal Expansion	4.5 x 10-6/K
Symbol	W	Theoretical Density (g/cc)	19.25
Atomic Weight	183.84	Z Ratio	0.163
Atomic Number	74	Sputter	DC
Color/Appearance	Grayish White, Lustrous, Metallic	Max Power Density (Watts/Square Inch)	100*
Thermal Conductivity	174 W/m.K	Type of Bond	Indium, Elastomer
Melting Point (°C)	3,410	Comments	Forms volatile oxides. Films are hard and adherent.

Tungsten Sputtering Target Stock Dimensions

Circular Sputtering Targets	Diameter	1.0″ 2.0″ 3.0″ 4.0″ 5.0″ 6.0″ up to 21″
Rectangular Sputtering Targets	Width x Length	5″ x 12″ 5””x 15″ 5″ x 20″ 5″ x 22″ 6″ x 20″
Thickness		0.125″, 0.25″

Tungsten Sputtering Target Advantages

• High-purity, sintered, and cast tungsten sputtering targets up to 99.95% and beyond.
• Rapid prototyping, powder metallurgy, and direct pressing.
• High density, the density of the tungsten sputtering target after casting can be more than 19.1g/cm3.
• The wide application of the powder metallurgy method makes the cost of tungsten targets lower than that of other target materials, such as titanium.
• Uniform composition and structure improve the deflection force of the tungsten target.
• Fine particle size, grain uniformity, other axes, high concentration, and coating product quality are higher.

Tungsten Sputtering Targets Production Process

Generally prepared by powder metallurgy method, the purity of tungsten powder should be above 99.95%, and the particle size should be between 3.2-4.2 μm. The specific process is as follows:

• Put the tungsten powder in the vacuum heat treatment furnace for pre-gassing, then introduce hydrogen and continue heating for degassing.
• The degassed tungsten powder is sintered once by vacuum hot pressing.
• The primary sintered product is passed through a hot isostatic press to complete the secondary sintering.
• After the secondary sintering, the whole surface of the product is ground by machining to get the final product.

Tungsten Sputtering Target Applications

• Semiconductor Manufacturing: In the manufacture of integrated circuits and microelectronic devices, tungsten sputtering targets are used to deposit conductive or barrier layers by Physical Vapor Deposition (PVD) technology.
• Photovoltaic Industry: Tungsten sputtering targets are used to produce solar panels to form highly efficient photovoltaic conversion layers through sputtering coating, improving the efficiency and stability of solar cells.
• Hard Coatings and Tool Manufacturing: Tungsten’s hardness and wear resistance make it a high-performance coating material. Tungsten sputtering targets are used to produce hard coatings for metal cutting tools, molds, etc., to improve their durability and wear resistance.
• Military and Aerospace: The high-density and high-strength properties of tungsten sputtering targets make them important in manufacturing military protective equipment and aerospace devices.
• Electronic Components: The high thermal conductivity and electrical conductivity of the tungsten sputtering target make it play an important role in the heat dissipation material and electromagnetic shielding material of electronic devices.

Tungsten Sputtering Targets Packaging

The Sputtering Targets are carefully placed in wooden cases or cartons with additional support from soft materials to prevent any shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.